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Market:
- Semiconductor & MEMS - Optics & Photonics - Automotive/Precision Machining - Photovoltaic  - FlashPhase™ - GPI™ Family - GPI™ Special Wavelengths - PTI™ 250 - VeriFire™ AT+ - VeriFire™ MST - VeriFire™ Asphere - NewView™ 600 Series - NewView™ 7000 Series - NewView™ MPT - ZMI™ Series - OEM Optics 

Semiconductor & MEMS

Our measuring instruments and automation solutions are used in many aspects of the semiconductor processes.

ZMI™ Series
ZMI™ 2000 System Photolithography steppers, mask and reticle writers, yield improvement tools, and metrology instruments all rely on displacement measuring interferometers (DMI's) to improve position accuracy. ZYGO, the technology leader in heterodyne displacement interferometry, has responded to these challenges with the ZMI™ line of displacement measuring interferometer systems.

The illustration shows how a ZMI™ system could be used to simultaneously track the positions of both the wafer and reticle stages, with a timing uncertainty on all axes of ± 1.2 nanoseconds.

Precision Stage Optics
Stage Mirror Assembly Stage Mirror Assembly Stepper manufacturers have relied on ZYGO's precision optics and metrology capabilities for years. Make ZYGO your source for precision stage mirror and opto-mechanical systems. As a producer of some of the world's finest optical components, ZYGO can handle all of your precision optic fabrication, polishing, coating, and assembly needs. Regardless of their size or shape, all components have extremely precise geometries and surface flatness. Surfaces can be better than λ/50 (12 nm), with less than one angstrom rms surface roughness. Angle tolerances can be held to 0.2 arc second.

NewView™ 7000 Series
Photo - NewView™ 6300 optical profiler The NewView™ 7000 Series of optical profilers are excellent for semiconductor applications because the measurements are noncontact, extremely fast, and provide a wide variety of numeric measurement results as well as informative three-dimensional displays of the surface. The NewView™ 7000 Series rapidly characterizes surfaces of ball-grid arrays, wire lead frames, leadless chip carriers. Measurements include: flatness, roughness, coplanarity, volume, and step height.

On packaging exteriors, the NewView™ measures depth and uniformity of laser ablation markings on wafer and IC packages. Also, critical surface topography parameters of MEMS devices, including form, step heights, and critical dimensions, can all be measured quickly and accurately with the NewView™ 7000 Series.

Custom Solutions

If you've browsed to the end of this page and still haven't found a standard ZYGO product that's just right for your needs, we have great news for you. ZYGO offers Custom Solutions to ensure a perfect fit for your particular application. We can modify an existing instrument, design and build special fixturing, customize a MetroPro® software application, or engineer a completely unique system just for you. Let us show you some examples of the numerous Custom Solutions we have provided for a wide range of applications. Getting started is easy - just contact your local ZYGO representative or send us a message to be on your way to a ZYGO Custom Solution. 
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